Aluminum alloy sand surface treatment before composite of 3C aluminum-plastic integrated structure.
1.Acidic liquid of environmentally friendly and fluorine-free, non-toxic heavy metals
2.Used to remove natural oxides of aluminum and its alloys and achieve a clean and good roughening effect on the sand surface. The roughness Ra can reach 3-12um. If matched with conventional polishing, it can be applied to sanding treatment of building profiles
3.Improving the bonding strength between the post process electrolytic conversion film and the aluminum substrate is more conducive to the bonding between aluminum and plastic
Pre treatment of 3C aluminum-plastic integrated structure before composite.
1.Non toxic heavy metals, non-fluorine, fit in ROHS requirements
2.Aluminum alloy formation of nanopores is uniform and good,increasing the proportion of effective nano-holes
Pre treatment of 3C aluminum-plastic integrated structure before composite.
1.Non toxic heavy metals, fluorine-free, fit in ROHS requirements
2.Intermediate initiator for polymerization of specific engineering plastics with micro-expanded pores and nano-pore wall adhesion.
Pre treatment of 3C titanium plastic integrated structure before composite/
Pretreatment of titanium plastic integrated structure before composite
1.Non toxic heavy metals, fluoride free, meet with ROHS requirements;
2.Remove oxidized film and natural oxidized film produced by the processing of titanium and titanium alloy molding materials.
Pre treatment of 3C titanium plastic integrated structure before composite/
Pretreatment of titanium plastic integrated structure before composite
1.Non toxic heavy metals, fluoride-free, meet with ROHS requirements;
2.Applicable to the treatment of monomer titanium material,not suitable for titanium composite materials;
3.The nanopore is relatively large and uniformly distributed.
Pre treatment of 3C titanium plastic integrated structure before composite/
Pretreatment of titanium plastic integrated structure before composite
1.Non toxic heavy metals, fluoride-free, meet with ROHS requirements;
2.Match with RTL-6141 apparent hole,making the titanium surface with a polarized surface, beneficial for combination
Pre treatment before composite of copper and engineering plastics, application areas:
1. Chip packaging: The lead frame carrier for the internal circuit and external electrical components of the chip is integrated injection molded using copper and engineering plastic
2. New energy battery: functional plug, using copper and insulating plastic integrated injection molding
3. Copper enameled wire: The immersion coating of copper wire and insulating paint, as well as the exceptionally strong bonding between the insulating paint layer and copper wire
4. Printed circuit board: Copper coated circuits are cured like PP to produce double-layer or multi-layer circuit boards
1.Produce a non stimulation smell;
2.Non toxic heavy metals, fluoride-free, meet with ROHS requirements
Pre treatment before composite of copper and engineering plastics, application areas:
1. Chip packaging: The lead frame carrier for the internal circuit and external electrical components of the chip is integrated injection molded using copper and engineering plastic
2. New energy battery: functional plug, using copper and insulating plastic integrated injection molding
3. Copper enameled wire: The immersion coating of copper wire and insulating paint, as well as the exceptionally strong bonding between the insulating paint layer and copper wire
4. Printed circuit board: Copper coated circuits are cured like PP to produce double-layer or multi-layer circuit boards
1.Non toxic heavy metals, fluoride-free, meet with ROHS requirements;
2.After treatment, a clean and micro roughened copper surface can be obtained, which can effectively remove the oxide film on the surface of copper and its alloys
Pre treatment before composite of copper and engineering plastics, application areas:
1. Chip packaging: The lead frame carrier for the internal circuit and external electrical components of the chip is integrated injection molded using copper and engineering plastic
2. New energy battery: functional plug, using copper and insulating plastic integrated injection molding
3. Copper enameled wire: The immersion coating of copper wire and insulating paint, as well as the exceptionally strong bonding between the insulating paint layer and copper wire
4. Printed circuit board: Copper coated circuits are cured like PP to produce double-layer or multi-layer circuit boards
1.Non toxic heavy metals, fluoride-free, meet with ROHS requirements
2.Extending the service life of film-forming solution and improving film-forming effect
Pre treatment before composite of copper and engineering plastics, application areas:
1. Chip packaging: The lead frame carrier for the internal circuit and external electrical components of the chip is integrated injection molded using copper and engineering plastic
2. New energy battery: functional plug, using copper and insulating plastic integrated injection molding
3. Copper enameled wire: The immersion coating of copper wire and insulating paint, as well as the exceptionally strong bonding between the insulating paint layer and copper wire
4. Printed circuit board: Copper coated circuits are cured like PP to produce double-layer or multi-layer circuit boards
1.Non toxic heavy metals, fluoride-free, meet with ROHS requirements;
2.Enhance the combination between glue coating, and copper substrate
Pre treatment before composite of copper and engineering plastics, application areas:
1. Chip packaging: The lead frame carrier for the internal circuit and external electrical components of the chip is integrated injection molded using copper and engineering plastic
2. New energy battery: functional plug, using copper and insulating plastic integrated injection molding
3. Copper enameled wire: The immersion coating of copper wire and insulating paint, as well as the exceptionally strong bonding between the insulating paint layer and copper wire
4. Printed circuit board: Copper coated circuits are cured like PP to produce double-layer or multi-layer circuit boards
1.Non toxic heavy metals, fluoride-free, meet with ROHS requirements;
2.Solidify into film effect,enhancing the combine strength between engineering plastics and copper substrates
